Notice of Exhibition at SEMICON Japan 2025

We are pleased to announce that our company will exhibit at SEMICON Japan 2025, held from Wednesday, December 17 to Friday, December 19, 2025.
Please be sure to visit our booth when you attend the event.

Panel Exhibits
From Tatsumo, we will introduce products from three divisions: semiconductor manufacturing equipment, clean transfer systems, and cleaning equipment. In addition, our booth will feature wafers processed by our equipment, as well as live demonstrations of transfer robots and aligners.
We look forward to seeing you there!

Panel Exhibits
■ Temporary Bonding / Debonding System
Our bonding/debonding equipment provides high precision and stability in handling ultra-thin wafers. It prevents wafer warping and breakage during thinning processes, ensuring highly reliable and efficient processing.

■ Auto-Tape Changer System
This system automatically replaces the peeling tape used in the detachment process, contributing to the realization of next-generation fully automated, operator-free production systems.

■ Contact-Free Chuck
This equipment enables residue removal without any physical contact with the backside of the wafer, minimizing the risk of wafer damage and greatly expanding design flexibility for future development.

■ Single Wet Processor
Based on our proven CENOTE® series of multifunctional single-wafer cleaning systems—featuring high-performance SPIN CUP cleaning, vertical DIP immersion, and vertical scrub brushes (front/back/edge)—this equipment achieves higher throughput and improved cleaning performance.

■ Nanoimprint
Widely applicable to next-generation optical devices such as AR glasses. The vacuum process reduces particles and ensures high reproducibility, while using glass replicas enables highly precise alignment.

■ Slit Coater for PLP
Applying top-level technology developed for liquid crystal coating equipment, this system forms extremely uniform, high-quality thin films. Combined with a drying unit, it significantly improves productivity and product reliability.

■ Debond Cleaner for PLP
Expanding UV laser processing and spin cleaning technologies developed for wafer processes to PLP applications. Designed to accommodate substrate-specific warpage, this system enhances functionality and offers a fully automated debond cleaning process.

■ Single Wafer Processor
Based on the proven CENOTE® series, this multifunctional single-wafer cleaning system incorporates high-performance SPIN CUP cleaning, vertical DIP immersion, and vertical scrub brushes (front/back/edge) to achieve higher throughput and improved cleaning performance.

Live Demonstration
■ Transfer Robot

Event Dates: December 17 (Wed) – December 19 (Fri), 2025
Venue: Tokyo Big Sight, East Exhibition Hall
Booth No.: E4726
SEMICON JAPAN 2025