PRODUCTS

Clean Transfer System

Atmospheric RobotMTQ Series

サーボモーター仕様フリーアクセスロボット
MTQ Series Servo MotorFree Access Robot MTQ-E

This transfer robot handles wafer sizes up to 300mm.

This high-speed, ultra clean robot is a flagship model in the Tazmo line.

Features

###Accesses three FOUPs without tracks.

###Changer mechanism reduces wafer swap-out times.

###Mapping sensor options are available.

###The modular design of the R・T unit and elevation unit enables easy maintenance, and also supports a long vertical stroke.

###A new line up for 450mm wafer transfer with improved arm rigidity.

Specification

Wafer handling
φ100mm to φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Range of motion
R:590㎜(maximum arm reach,excluding end-effector)T:350°(±175° from Home pos)W:350°(±180° from Home pos)Z:330㎜P:180deg
Repeatability
XY:±0.1mm or less(3σ)Z:±0.05mm or less(3σ)P:0.02deg or less(3σ)
Wafer holding method
Selectable from options
Wafer detection
Vacuum sensor with digital display
Communication
RS232C,RS-485
Utility
Power:1φ AC100V 7.5A 1line :1φ AC208V 5.0A 1lineVacuum:-80 kPa or less 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
Mass
Main body:Appox.50kgController(MCQ):Appox.18kg
MTQ Series Servo MotorFree Access Robot MTQ-C

This transfer robot handles wafer sizes up to 300mm.

This high-speed, ultra clean robot is a flagship model in the Tazmo line.

Features

###Accesses two FOUPs without tracks.

###Mapping sensor options are available.

###The modular design of the R・T unit and elevation unit enables easy maintenance, and also supports a long vertical stroke.

###A new line up for 450mm wafer transfer with improved arm rigidity.

Specification

Wafer handling
φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Range of motion
R:430㎜(maximum arm reach,excluding end-effector)T:350°(±175° from Home pos)W:350°(±180° from Home pos)Z:330㎜P:180deg
Repeatability
XY:±0.1mm or less(3σ)Z:±0.05mm or less(3σ)P:0.05deg or less(3σ)
Wafer holding method
Selectable from options
Wafer detection
Vacuum sensor with digital display
Communication
RS232C,RS-485
Utility
Power:1φ AC200V~AC230V 5.0A 1lineDryair:0.5MPa 150L/min or more 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
Mass
Main body:Appox.60kgController(MCQ):Appox.18kg
MTQ Series Servo MotorFree Access Robot MTQ-D

This transfer robot handles wafer sizes up to 300mm.

This high-speed, ultra clean robot is a flagship model in the Tazmo line.

Features

###Accesses two FOUPs without tracks.

###Mapping sensor options are available.

###The modular design of the R・T unit and elevation unit enables easy maintenance, and also supports a long vertical stroke.

###A new line up for 450mm wafer transfer with improved arm rigidity.

Specification

Wafer handling
φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Range of motion
R:480㎜(maximum arm reach,excluding end-effector)T:350°(±175° from Home pos)W:360°(±180° from Home pos)Z:330㎜P:185deg
Repeatability
XY:±0.1mm or less(3σ)Z:±0.05mm or less(3σ)P:±0.1deg or less(3σ)
Wafer holding method
Selectable from options
Wafer detection
Vacuum sensor with digital display
Communication
RS232C,RS-485
Utility
Power:1φ AC200V~AC230V 5.0A 1lineDryair:0.5MPa 150L/min or more 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
Mass
Main body:Appox.60kgController(MCQ):Appox.18kg
サーボモーター仕様フリーアクセスロボット
MTQ Series Servo MotorFree Access Robot MTQ-G

This transfer robot handles wafer sizes up to 450mm.

Features

###Accesses two FOUPs without tracks.

###Mapping sensor options are available.

###The modular design of the R・T unit and elevation unit enables easy maintenance, and also supports a long vertical stroke.

###A new line up for 450mm wafer transfer with improved arm rigidity.

Specification

Wafer handling
φ300mm to φ450mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Range of motion
R:590㎜(maximum arm reach,excluding end-effector)T:350°(±175° from Home pos)W:350°(±180° from Home pos)Z:300㎜P:180deg
Repeatability
XY:±0.1mm or less(3σ)Z:±0.05mm or less(3σ)P:0.05deg or less(3σ)
Wafer holding method
Selectable from options
Wafer detection
Vacuum sensor with digital display
Communication
RS232C,RS-485
Utility
Power:1φ AC200V~AC230V 5.0A 1lineDryair:0.5MPa 150L/min or more 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
Mass
Main body:Appox.65kgController(MCQ):Appox.18kg
lcd-eg@tazmo.co.jp

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Sales Div.Transfer Business Unit

(086)239-5117

(086)239-5118

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