【TAZMO Apprecia Formosa Inc. 】SEMICON TAIWAN 2023

TAZMO Apprecia Formosa Inc., subsidiary of TAZMO Co., Ltd. Is planning to exhibit at SEMICON TAIWAN 2023.

Date : Sep. 6 th -8 th

Location : Taipei Nangang Exhibition Center

Booth No. ：L0730 (4F)

Panel exhibition：
a) Temporary Bonding / Debonding TWS series for Power Devices.
b) Temporary Bonding / Debonding TWH series for Advanced Package.
c) Nanoimprint Lithography DyadTM series.
d) Panel Level Package Equipment TZ series.
e) Clean Robot System TT301A series and ET New series.
f) Pre-Aligner for Silicon Wafer(Backside VAC chucking) MAF-R series
g) Phosphoric Acid Reclaim System PSYRION®
h) Wet Single Cleaning & Etching System CENOTE®
i) Direct Transfer Bonding & Inkjet
j) Laser Assisted Bonding