The 17th MEMS Engineer Forum (MEF)

We are pleased to announce that we will be exhibiting at the 17th MEMS Engineer Forum (MEF2026), to be held on April 21–22, 2026, at KFC Hall in Ryogoku, Tokyo.

MEF is a forum consisting of an international symposium and a technical exhibition, providing opportunities for discussion and exchange from an engineering perspective on the current status and future outlook of MEMS technologies. The forum brings together MEMS researchers, developers, and engineers from Japan and abroad, covering a wide range of topics from fundamental technologies to adjacent technical fields.

As part of our contribution to next-generation semiconductor packaging, we will deliver a technical presentation on our DTB (Direct Transfer Bonding) Hybrid Bonder equipment technology. This presentation will introduce the latest advancements in DTB technology, which enables high-precision alignment and low-particle bonding, as well as our ongoing development initiatives.

At our exhibition booth, we will showcase the DTB featured in the presentation, along with our “Laser-Assisted Wafer-level Bonding System,” which enables bonding without heating the entire wafer through localized laser-assisted heating. Our proprietary technologies support high quality and high yield across a wide range of applications, from MEMS to advanced packaging.

If you are attending MEF2026, we would be pleased if you could visit our exhibition booth.

Dates：April 21–22, 2026

Location：KFC Hall, Ryogoku, Tokyo, Japan

Booth：KFC Hall 2nd Floor, C-11

Presentation : Tuesday, April 21, 5:10–5:35 p.m.

Advancements in Direct Transfer Bonding (DTB) for High-Precision Integration of Ultra-Thin and Delicate Chips

MEF Website：
https://m-e-f.info/home_en/