2026 IEEE 76th Electronic Components and Technology Conference (ECTC)

We are pleased to announce that we will be exhibiting at ECTC 2026 again this year. At ECTC 2026, we will introduce our company's latest technologies related to cutting-edge packaging.

Our representatives will be on-site to directly explain the latest technological trends and our initiatives. In addition, this year we will also place a poster session as DTB (Direct Transfer Bonding) Hybrid bonder equipment with the most recent bonding method status at poster session area.

We sincerely look forward to your attendance.

Dates：May 26th – May 29th *TAZMO exhibits May 27th & May 28th

Location：JW Marriott & The Ritz-Carlton Grande Lakes Resort (Mediterranean Ballroom)

4040 Central Florida Parkway, Orlando, Florida, USA, 32837

Booth：#912

ECTC Website：https://www.ectc.net/