PRODUCTS
Semiconductor Manufacturing Equipment
Coater/Developer
CSX Series CSX2000
The CSX2000 series features flexibility and expandability to the device configuration for Coater / developer from research and development to mass production.
High-performance process units are available, especially for thick film processes for BEOL.
For the configuration of the equipment, the cluster system allows to select configure the required number of processing units according to the required Coating and Developing processing and process capability.
Features
Platform
###CSX2000 series are automatic coater/Developer for cassette to cassette , φ150mm～200mm wafer.
###For the configuration of the equipment, the cluster system allows to select configure the required number of processing units for required process capability.
Process Unit
###Coater
###Tazmo offers from the standard process for PR/PI coating ; Spin coat unit/ Bake unit/Cool unit, to the special process; Circulation spin cup unit/Spinless coating unit.
Especially, PI/PR thick film process 10～100um are our main target on PhotoLithography Process.
###Developer
###Basic paddle , spray developping process for PR/PI.
Dry Film process; temparature controling and high pressure is also available.
Operability
###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.
###From R & D to mass production configuration that takes into consideration will further improve the functionality.
Specification
- Substrate sizes
- φ150mm-200mm wafer
- Control method
- Collective control by desktop computer.
- Power supply specifications
- ３φ AC200Ｖ 50／60Ｈｚ
CSX Series CSX3000
The CSX3000 series features flexibility and expandability to the device configuration for Coater / developer from research and development to mass production.
High-performance process units are available, especially for thick film processes for BEOL.
For the configuration of the equipment, the cluster system allows to select configure the required number of processing units according to the required Coating and Developing processing and process capability.
Features
Platform
###CSX3000 series are automatic coater/Developer for cassette to cassette , φ200mm～300mm wafer, and Square panel.
###For the configuration of the equipment, the cluster system allows to select configure the required number of processing units for required process capability.
Process Unit
###Coater
###Tazmo offers from the standard process for PR/PI coating ; Spin coat unit/ Bake unit/Cool unit, to the special process; Circulation spin cup unit/Spinless coating unit.
Especially, PI/PR thick film process 10～100um are our main target on PhotoLithography Process.
###Developer
###Basic paddle , spray developping process for PR/PI.
Dry Film process; temparature controling and high pressure is also available.
Operability
###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.
###From R & D to mass production configuration that takes into consideration will further improve the functionality.
Specification
- Substrate sizes
- φ200mm-300mm wafer
- Control method
- Desk top computer.
- Power supply specifications
- ３φ AC200Ｖ 50／60Ｈｚ
SPR Series SPR3000
The SPR3000 series are a flagship model for mass production in BEOL, especiall thick film process.
TAZMO has spent over 40 years for Back end process, and developed High- performance process; Unti- Bake function, Tact Management function, etc.
For the configuration of the equipment, the cluster system allows to select configure the required number of processing units according to the required Coating and Developing processing and process capability.
Features
Platform
###SPR 3000 series are automatic coater/Developer for cassette to cassette , φ200mm～300mm wafer.
###For the configuration of the equipment, the cluster system allows to select configure the required number of processing units for required process capability.
Process Unit
###Coater
###Tazmo offers from the standard process for PR/PI coating ; Spin coat unit/ Bake unit/Cool unit, to the special process; Circulation spin cup unit/Spinless coating unit.
Especially, PI/PR thick film process 10～100um are our main target on PhotoLithography Process.
###Developer
###Basic paddle , spray developping process for PR/PI.
Dry Film process; temparature controling and high pressure is also available.
Operability
###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.
Specification
- Substrate sizes
- φ200mm-300mm wafer
- Spin cup for Coater/Developer
- Max 4 cups
- Bake & Cool
- Max 16 units（250℃） - Anti-over bake function
- Cool plate
- Chiller(option)
- High viscosity
- Tazmo Designed Pump
- High temperature Bake
- Bake:(Max 450℃) (Option)
Sales Div.Process1 Business Unit
(086)239-5530
(086)239-5511
