PRODUCTS

Semiconductor Manufacturing Equipment

Bonder/Debonder

塗布貼合装置
TWS Series Mounter

TAZMO Mounter contains various solutions for Ultra-thin wafers of Advanced 2.5/3D packaging which countermeasures against device thinning vulnerabilities and further reduce the size and save energy of semiconductor packaging field.

This equipment is based on our PR/PI coating technology to apply with a uniformed adhesive, then using ultraviolet rays to attaches wafer to the carrier

for curing.

Features

Platform

###Ideal Mounter(Bonder) for UV curable adhesive from TAZMO's many years of coating technology.

###Automatic processing from Spin Coating adhesive to bonding with carrir glass.

Process Unit

###Mounting with UV curable adhesive, no wafer damage from thernal effection.(room temparature process)

###Achieved below 3um TTV(Total Thickness Value) 

###WPH over 25 wafers(Depends on device wafer structure)

###Available for carrier glass recycling system.

###Completely dry process

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Substrate sizes
・2000 Series φ150mm-200mm wafer, ・3000 Series φ200mm-300mm wafer
Carrier Wafer
φ±1.0mm glass
Spin Cup
No organic solvent
键合机构
Cassette
・2000 Series OPEN, by pitch Cassette ・3000 Series FOUP/FOSB
Other
comforms to safety standards
支持体剥離装置
TWS Series Demounter

The mounted wafer after back grinding or other post process will be demounted from carrier glass.

Features

Platform

###After demounting by the YAG Laser emission for release layer, peeling off the adhesive Layer on device wafer with Peeling tape.

Process Unit

###WPH over 25 wafers(Depends on device wafer structure)

###YAG Laser

###Peeling unit

###Available for Tape Frame

###Completely dry process

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Substrate sizes
・2000 Series φ150mm-200mm wafer, ・3000 Series φ200mm-300mm wafer
Carrier Wafer
GLASS
Laser
YAG Laser
PEEL
1 unit
Cassette
OPEN or Tape frame cassette
Other
comforms to safety standards
支持体剥離層成膜装置
TWS Series Release Layer Coater

Before monting, the carrier glass has to be coated with release layer for Laser demounting Process.

New or cleaned carrier glass will be coated with release layer befor mounting process.

Our Glass ID management function can controls the carrier glass condition from the first using by counting ID on glass carrier.

Features

Platform

###High accuracy coating of release layer liquid with many years of coating know-how.

Process Unit

###High WPH

###Canister Cabinet

###Spin Coating Cup

###Bake Plate 

###Optical Inspection system(Option)

###Organic Solvent in use

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Substrate sizes
・2000 Series φ150mm-200mm glass(±1.0) ・3000 Series φ200mm-300mm glass(±1.0)
Chemicals used
Please contact us
Solvent
Please contact us
Spin Cup
Please contact us
Bake
Please contact us
Cassette
Please contact us
Other
comforms to safety standards
支持体洗浄装置
TWS Series Carrier Cleaner

After demounting process, the residue on the demounted glass carrier need to be cleaned.

Features

Platform

###Multi Layout system; Stand alone, semi-automatic and fully automatic equipments are available.

Process Unit

###Canister Cabinet

###Spin Clean Cup with edge and surface clean brush

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Substrate sizes
・2000 Series φ150mm-200mm glass(±1.0) ・3000 Series φ200mm-300mm glass(±1.0)
Chemicals used
Please contact us
Solvents
Please contact us
Spin Cup
Please contact us
Bake
Please contact us
Cassette
Please contact us
Other
comforms to safety standards

Sales Div. Process1 Business Unit

(086)239-5530

(086)239-5511

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