SEMICON WEST 2026 Exhibition Announcement
SEMICON WEST 2026 Exhibition Announcement
We are pleased to announce that we will be exhibiting at SEMICON WEST 2026.
During the exhibition, we will showcase our latest solutions for the semiconductor manufacturing and advanced packaging industries, featuring the following products and technologies.
Featured Exhibits
- Laser-Assisted Bonder
- Slit Coater, Developer, and Bonder for Panel Level Packaging (PLP)
- Clean Transfer Systems
- Wafer Handling Robots
- Pre-Aligners
Regarding our Wafer Handling Robot, the industry is transitioning from conventional systems that use through-beam sensors for wafer presence and tilt detection to a mapping approach utilizing ultra-miniature CCD cameras integrated into the robot hand. We will have an actual system on display and invite you to see this innovative technology firsthand.
We encourage you to visit our booth and experience our latest technologies. We look forward to welcoming you at the event.
- Translated into a professional trade show announcement style suitable for international visitors and industry professionals.
- Used industry-standard terminology such as Wafer Handling Robot, Pre-Aligner, Clean Transfer System, and Laser-Assisted Bonder.
- Refined the CCD camera description to clearly communicate the technology transition and its benefits in a concise marketing-oriented manner.
