IMAPS Exhibition Announcement

Exhibition Announcement

We are pleased to announce that we will be exhibiting at IMAPS Symposium 2026.

During the exhibition, we will showcase our latest solutions for the semiconductor manufacturing and advanced packaging industries, featuring the following products and technologies.

Featured Exhibits

• Temporary Bonder / Debonder (TBDB)
• D2W Bonder (Direct Transfer Bonding)
• Laser-Assisted Bonder
• Slit Coater, Developer, and Bonder for Panel Level Packaging (PLP)

We invite you to visit our booth and experience our latest technologies firsthand. We look forward to welcoming you at the event.

Exhibition Information
Event: IMAPS Symposium 2026
Dates: September 29-30, 2026
Venue: Encore Boston Harbor, 1 Broadway, Everett, MA 02149, USA
Booth: #117
Website: https://imaps.org/events/EventDetails.aspx?id=1886219&group=

Main Improvements

• Rewritten in a natural and professional trade show announcement style appropriate for international audiences.
• Standardized technical terminology such as Temporary Bonder/Debonder (TBDB), Direct Transfer Bonding, and Panel Level Packaging (PLP).
• Enhanced readability with clear headings and bullet points commonly used in exhibition promotions.