PRODUCTS

Clean Transfer System

Pre-Aligner

MAF-SH Series
MAF-S Series For Compound Wafer,Glass WaferEdge Hold MAF-SHKZ

This 300mm mechanically clamping wafer aligner minimizes wafer particle contamination by avoiding contact with the backside of the wafer.

Features

###Configurable for compound semiconductor wafers and glass wafers.(Please inquire for details)

###Clean alignment enabled by limiting contact to the wafer edge.

###Notch/Flat are automatically recognized, eliminating the need for host controller settings.

###Built-in controller for a compact design.

Specification

Wafer handling
φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Alignment time
8.0seconds or less(20.0seconds of less when separate chucking required)
Alignment accuracy
θ:±0.2° or less(3σ)
Wafer off-center limit
±1mm or less(Wafer offset from chuck center)
Wafer holding method
Edge hold
Wafer detection
Photo micro sensor
Communication
RS-232C(Serial Interface)
Utility
Power:DC24V±10% 3A 1lineDry air:φ6mm 0.35MPa to 0.4MPa 1line
Mass
Main body:Appox.8kg
MAF-SJ Series
MAF-S Series For Compound Wafer,Glass WaferEdge Hold MAF-SJ

This 200mm mechanically clamping wafer aligner minimizes wafer particle contamination by avoiding contact with the backside of the wafer.

Features

###Configurable for compound semiconductor wafers and glass wafers.(Please inquire us for details)

###Clean alignment enabled by limiting contact to the wafer edge.

###Notch/Flat are automatically recognized, eliminating the need for host controller settings.

###Built-in controller for a compact design.

Specification

Wafer handling
φ200mm SEMI/JEIDA standard wafer.
Alignment time
8.5seconds or less(20.0seconds of less when separate chucking required)
Alignment accuracy
θ:±0.2° or less(3σ)
Wafer off-center limit
±1mm or less(Wafer offset from chuck center)
Wafer holding method
Edge hold
Wafer detection
Photo micro sensor
Communication
RS-232C(Serial Interface)
Utility
Power:DC24V±10% 3A 1lineDry air:φ6mm 0.35MPa to 0.4MPa 1line
Mass
Main body:Appox.8kg
MAF-S Series For Compound Wafer,Glass WaferEdge Hold MAF-SK

This 150mm mechanically clamping wafer aligner minimizes wafer particle contamination by avoiding contact with the backside of the wafer.

Features

###Configurable for compound semiconductor wafers and glass wafers.(Please inquire us for details)

###Clean alignment enabled by limiting contact to the wafer edge.

###Notch/Flat are automatically recognized, eliminating the need for host controller settings.

###Built-in controller for a compact design.

Specification

Wafer handling
φ150mm SEMI/JEIDA standard wafer.
Alignment time
8.5seconds or less(20.0seconds of less when separate chucking required
Alignment accuracy
θ:±0.2° or less(3σ)
Wafer off-center limit
±1mm or less(Wafer offset from chuck center)
Wafer holding method
Edge hold
Wafer detection
Photo micro sensor
Communication
RS-232C(Serial Interface)
Utility
Power:DC24V±10% 5A 1lineDry air:φ6mm 0.35MPa to 0.4MPa 1line
Mass
Main body:Appox.8kg

Sales Div.Transfer Business Unit

+81-86-239-5117

+81-86-239-5118

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