PRODUCTS
Clean Transfer System
Atmospheric Robot
MTE Series Servo MotorFree Access Robot MTE-E
This transfer robot handles wafer sizes up to 300mm.
This high-speed, ultra clean robot is a flagship model in the Tazmo line.
Features
###Accesses three FOUPs without tracks.
###Changer mechanism reduces wafer swap-out times.
###Mapping sensor options are available.
###The modular design of the R・T unit and elevation unit enables easy maintenance, and also supports a long vertical stroke.
###A new line up for 450mm wafer transfer with improved arm rigidity.
Specification
- Wafer handling
- φ100mm to φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
- Range of motion
- R：590㎜(maximum arm reach,excluding end-effector)T：350°(±175° from Home pos)W：350°(±180° from Home pos)Z：330㎜P:180deg
- Repeatability
- XY：±0.1mm or less（3σ)Z：±0.05mm or less（3σ)P:0.02deg or less（3σ)
- Wafer holding method
- Selectable from options
- Wafer detection
- Vacuum sensor with digital display
- Communication
- RS232C,RS-485
- Utility
- Power：1φ AC100V 7.5A 1line ：1φ AC208V 5.0A 1lineVacuum：-80 kPa or less 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
- Mass
- Main body:Appox.50kgController(MCE)：Appox.18kg
MTE Series Servo MotorFree Access Robot MTE-C
This transfer robot handles wafer sizes up to 300mm.
This high-speed, ultra clean robot is a flagship model in the Tazmo line.
Features
###Accesses two FOUPs without tracks.
###Mapping sensor options are available.
###The modular design of the R・T unit and elevation unit enables easy maintenance, and also supports a long vertical stroke.
###A new line up for 450mm wafer transfer with improved arm rigidity.
Specification
- Wafer handling
- φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
- Range of motion
- R：430㎜(maximum arm reach,excluding end-effector)T：350°(±175° from Home pos)W：350°(±180° from Home pos)Z：330㎜P:180deg
- Repeatability
- XY：±0.1mm or less（3σ)Z：±0.05mm or less（3σ)P:0.05deg or less（3σ)
- Wafer holding method
- Selectable from options
- Wafer detection
- Vacuum sensor with digital display
- Communication
- RS232C,RS-485
- Utility
- Power：1φ AC200V~AC230V 5.0A 1lineDryair：0.5MPa 150L/min or more 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
- Mass
- Main body:Appox.60kgController(MCE)：Appox.18kg
MTE Series Servo MotorFree Access Robot MTE-D
This transfer robot handles wafer sizes up to 300mm.
This high-speed, ultra clean robot is a flagship model in the Tazmo line.
Features
###Accesses two FOUPs without tracks.
###Mapping sensor options are available.
###The modular design of the R・T unit and elevation unit enables easy maintenance, and also supports a long vertical stroke.
###A new line up for 450mm wafer transfer with improved arm rigidity.
Specification
- Wafer handling
- φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
- Range of motion
- R：480㎜(maximum arm reach,excluding end-effector)T：350°(±175° from Home pos)W：360°(±180° from Home pos)Z：330㎜P:185deg
- Repeatability
- XY：±0.1mm or less（3σ)Z：±0.05mm or less（3σ)P:±0.1deg or less（3σ)
- Wafer holding method
- Selectable from options
- Wafer detection
- Vacuum sensor with digital display
- Communication
- RS232C,RS-485
- Utility
- Power：1φ AC200V~AC230V 5.0A 1lineDryair：0.5MPa 150L/min or more 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
- Mass
- Main body:Appox.60kgController(MCE)：Appox.18kg
MTE Series Servo MotorFree Access Robot MTE-G
This transfer robot handles wafer sizes up to 450mm.
Features
###Accesses two FOUPs without tracks.
###Mapping sensor options are available.
###The modular design of the R・T unit and elevation unit enables easy maintenance, and also supports a long vertical stroke.
###A new line up for 450mm wafer transfer with improved arm rigidity.
Specification
- Wafer handling
- φ300mm to φ450mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
- Range of motion
- R：590㎜(maximum arm reach,excluding end-effector)T：350°(±175° from Home pos)W：350°(±180° from Home pos)Z：300㎜P:180deg
- Repeatability
- XY：±0.1mm or less（3σ)Z：±0.05mm or less（3σ)P：0.05deg or less（3σ)
- Wafer holding method
- Selectable from options
- Wafer detection
- Vacuum sensor with digital display
- Communication
- RS232C,RS-485
- Utility
- Power：1φ AC200V~AC230V 5.0A 1lineDryair：0.5MPa 150L/min or more 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
- Mass
- Main body:Appox.65kgController(MCE)：Appox.18kg
Sales Div.Transfer Business Unit
+81-86-239-5117
+81-86-239-5118
