PRODUCTS

Semiconductor Manufacturing Equipment

Bonder/DebonderTWS Series

支持体機械剥離洗浄装置
TWH Series Mechanical Debonder Cleaner

The equipment that debond the carrier from a device wafer that is bonded with a thermosetting / UV curable adhesive/releasing layer.

After mechanical debonding, it automatically cleans the residue on the wafer.

Tape frame handling realizes the device wafer can be thinned to the limit of possible numerical values in theory.

Features

Platform

###Multi Layout system; Stand alone, semi-automatic and fully automatic equipments are available.

Process Unit

###Mechanical Debonding unit

###Wafer Cleaner 

###Various safety specifications; explosion-proof, fire difence law.

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Automatic Mechanical debonder cleaner
TWH-SR-CC series
Substrate sizes
φ200mm-300mm wafer on tape frame
Wafer Loader/Unloader
Tape frame cassette / Loadport
Carrier wafer Unloader
Open cassette
EFEM
Transfer Robot and Aligner
Mechanical Debonding Unit
1 unit only
Cleaning Unit
Max 2 units
PEEL装置
TWH Series PEEL Unit

Peeling off the residues remaining on the device wafer surface after debonding carrier. This peeling is performed by peeling tape.

It is recommended in the dry process and cost reduction.

Features

Platform

###Multi Layout system; Stand alone, semi-automatic and fully automatic equipments are available.

Process Unit

###Peel pressure monitoring function

###Tape Frame free function(Option)

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Peel Unit
TWH-PL series
Substrate sizes
φ200mm-300mm wafer
Peeling Pressure
0 ~ 300 N
Peeling Speed
0 ~ 20 mm/sec
Peel tape core diameter
φ76.8 mm
Other
comforms to safety standards
機械剥離装置
TWH Series Mechanical Debonder Cleaner

TAZMO has developed an overwhelming mechanical debonder over many years.

It has a strong power and soft structure for the device wafer and carrier.

(Patent Pending)

Features

Platform

###Available for thermosetting / UV curable adhesive

(room temparature) Mechanical debonding equipment

Process Unit

###TAZMO special desigh debonding Unit,(Patent Pending) Ultra Smoothness

###Processing wafer on Tape Frame.

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Mechanical Debonder
TWH-SR series
Substrate sizes
φ150mm-300mm wafer
Carrier Wafer
Si, glass, etc
Wafer handling
Tape frame handling
Wafer Chuck
Porous chuck
Debonding Method
TAZMO Designed Blade method
Other
Room temparature process
テープフレーム
対応洗浄装置
TWH Series Cleaner

Each wafer on tape frame can be cleaned with especial designed unit.

The tape frame has no solvent contact, but only devise wafer due to the special guard during cleaning process.

Features

Platform

###Multi Layout system; Stand alone, semi-automatic and fully automatic equipments are available.

Process Unit

###high-step device application

###Selectable nozzle system

###Available with 2 fluid sprays

###Available with an ultrasonic cleaning

###Waste liquid tank filtration method

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Cleaner
TWH-CC series
Substrate sizes
φ150mm-300mm wafer on tape frame
Rotation Speed
0 ~ 1500[rpm]
Nozzle Qty
Max 2 nozzles for each chamber
Other
comforms to safety standards
TWH Series Bonder

TAZMO new Bonder handling thermosetting type/thermoplastic type materials is available.

This new Bonder based on tool conept of cost-effectiveness as well as high-performance will satisfy customer's requirements.

Features

Platform

###Multi Layout system; Stand alone, semi-automatic and fully automatic equipments are available.

Process Unit

###Temperature up to 250℃

###Not only Glass bus also Si wafer can be used as support carrier

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Bonder
WH-BD series
Substrate sizes
φ200 or 300 mm
Alighment accuracy
X-Y: 30μm
Bonding pressure
φ300: 20kN φ200:10kN
Wafer Chuck
Electrostatic chuck
Temperature
Up to 250℃
Vacuum pressure
< 10Pa
Bonding accuracy
TTV < 3μm *uing bare wafer with 50μm film thickness
other
comforms to safety standards
塗布貼合装置
TWS Series Mounter

TAZMO Mounter contains various solutions for Ultra-thin wafers of Advanced 2.5/3D packaging which countermeasures against device thinning vulnerabilities and further reduce the size and save energy of semiconductor packaging field.

This equipment is based on our PR/PI coating technology to apply with a uniformed adhesive, then using ultraviolet rays to attaches wafer to the carrier

for curing.

Features

Platform

###Ideal Mounter(Bonder) for UV curable adhesive from TAZMO's many years of coating technology.

###Automatic processing from Spin Coating adhesive to bonding with carrir glass.

Process Unit

###Mounting with UV curable adhesive, no wafer damage from thernal effection.(room temparature process)

###Achieved below 3um TTV(Total Thickness Value) 

###WPH over 25 wafers(Depends on device wafer structure)

###Available for carrier glass recycling system.

###Completely dry process

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Substrate sizes
・2000 Seriesφ150mm-200mm wafer,・3000 Series φ200mm-300mm wafer
Carrier Wafer
φ±1.0mm glass
Spin Cup
No organic solvent
键合机构
Cassette
・2000 Series OPEN, by pitch Cassette・3000 SeriesFOUP/FOSB
Other
comforms to safety standards
支持体剥離装置
TWS Series Demounter

The mounted wafer after back grinding or other post process will be demounted from carrier glass.

Features

Platform

###After demounting by the YAG Laser emission for release layer, peeling off the adhesive Layer on device wafer with Peeling tape.

Process Unit

###WPH over 25 wafers(Depends on device wafer structure)

###YAG Laser

###Peeling unit

###Available for Tape Frame

###Completely dry process

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Substrate sizes
・2000 Series φ150mm-200mm wafer, ・3000 Series φ200mm-300mm wafer
Carrier Wafer
GLASS
Laser
YAG Laser
PEEL
1 unit
Cassette
OPEN or Tape frame cassette
Other
comforms to safety standards
支持体剥離層成膜装置
TWS Series Release Layer Coater

Before monting, the carrier glass has to be coated with release layer for Laser demounting Process.

New or cleaned carrier glass will be coated with release layer befor mounting process.

Our Glass ID management function can controls the carrier glass condition from the first using by counting ID on glass carrier.

Features

Platform

###High accuracy coating of release layer liquid with many years of coating know-how.

Process Unit

###High WPH

###Canister Cabinet

###Spin Coating Cup

###Bake Plate 

###Optical Inspection system(Option)

###Organic Solvent in use

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Substrate sizes
・2000 Series φ150mm-200mm glass(±1.0) ・3000 Series φ200mm-300mm glass(±1.0)
Chemicals used
Please contact us
Solvent
Please contact us
Spin Cup
Please contact us
Bake
Please contact us
Cassette
Please contact us
Other
comforms to safety standards
支持体洗浄装置
TWS Series Carrier Cleaner

After demounting process, the residue on the demounted glass carrier need to be cleaned.

Features

Platform

###Multi Layout system; Stand alone, semi-automatic and fully automatic equipments are available.

Process Unit

###Canister Cabinet

###Spin Clean Cup with edge and surface clean brush

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Substrate sizes
・2000 Series φ150mm-200mm glass(±1.0) ・3000 Series φ200mm-300mm glass(±1.0)
Chemicals used
Please contact us
Solvents
Please contact us
Spin Cup
Please contact us
Bake
Please contact us
Cassette
Please contact us
Other
comforms to safety standards
sem-eg@tazmo.co.jp

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