PRODUCTS

Semiconductor Manufacturing Equipment

Cleaning SystemsTIGRIS®

枚葉式エッチング・
洗浄システム
CENOTE® Single Wet Processor

CENOTE® is multifunctional wet processor with multi cup. It can supply clean chemical on wafer surface continuously with accurate control of chemical type, mixing rate, flow rate and temperature, in order to achieve high particle performance and critical etching control.

Features

Platform

CENOTE can process both side of wafer, able to avoid back side pollution and omit back side clean process. High wph achieved by multi cup system and continuous running.

Process Unit

###We have acid chemical process module, Alkali chemical process module and Solvent chemical process module to meet customer's request.

###Can be used to 8" and 12" wafer, and also can use 2 fluid type spray nozzle and Ultra sonic spray nozzle.

Operability

User friendly interface

Specification

Substrate sizes
200 mm / 300 mm wafer
リフトオフシステム
VAP Lift-off System

Lift-off System VAP200™/VAP300™ are unique system with batch type's dip module and single type's spin module. Which is useful for PR strip and Film removal process.

Features

Platform

Due to batch process at process bath and critical clean process at spin chamber, VAP can achieve optimal tact time process and able to use high temperature chemical and high pressure spray process. Also able to meet explosion-proof request.

Process Unit

###Hardware configuration which can used for various Solvent chemical.

###Can be used for 8" and 12" wafer

Operability

User friendly interface

Specification

Substrate sizes
200 mm / 300 mm wafer
バッチ式浸漬洗浄・
エッチングシステム
TIGRIS® Batch Type Wet Station

Batch Type Wet Station TIGRIS®200/TIGRIS®300 can be used for 200mm/300mm wafer, both for Cleaning and Etching. Not only applied to world wide standard specification, but also added our original technologies. By using monitoring system, TIGRIS® achieve high process performance. Also customer can add H3PO4 reclaim system PSYRION® or H3PO4 circulation system NISON® 1800 as option.

Features

Platform

High wph transfer system

Process Unit

###High process performance by chemical control with monitoring system

###Can add H3PO4 recycle system PSYRION® or H3PO4 circulation system NISON® 1800 for ECO and chemical usage reduction.

###Flexible configuration by combining process module

Operability

User friendly interface

Specification

Substrate sizes
200 mm / 300 mm wafer
mla-sag@tazmo.co.jp

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Sales Div. Apprecia Business Unit

(03)6892-5123

(03)6233-9730

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