PRODUCTS

Semiconductor Manufacturing Equipment

Coater/DeveloperSPR Series

CSX2000
CSX Series CSX2000

The CSX2000 series features flexibility and expandability to the device configuration for Coater / developer from research and development to mass production.

High-performance process units are available, especially for thick film processes for BEOL.

For the configuration of the equipment, the cluster system allows to select configure the required number of processing units according to the required Coating and Developing processing and process capability.

Features

Platform

###CSX2000 series are automatic coater/Developer for cassette to cassette , φ150mm~200mm wafer.

###For the configuration of the equipment, the cluster system allows to select configure the required number of processing units for required process capability.

Process Unit

###Coater

###Tazmo offers from the standard process for PR/PI coating ; Spin coat unit/ Bake unit/Cool unit, to the special process; Circulation spin cup unit/Spinless coating unit.

Especially, PI/PR thick film process 10~100um are our main target on PhotoLithography Process.

###Developer

###Basic paddle , spray developping process for PR/PI.

Dry Film process; temparature controling and high pressure is also available.

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

###From R & D to mass production configuration that takes into consideration will further improve the functionality.

Specification

Substrate sizes
φ150mm-200mm wafer
Control method
Collective control by desktop computer.
Power supply specifications
3φ AC200V 50/60Hz
CSX3000
CSX Series CSX3000

The CSX3000 series features flexibility and expandability to the device configuration for Coater / developer from research and development to mass production.

High-performance process units are available, especially for thick film processes for BEOL.

For the configuration of the equipment, the cluster system allows to select configure the required number of processing units according to the required Coating and Developing processing and process capability.

Features

Platform

###CSX3000 series are automatic coater/Developer for cassette to cassette , φ200mm~300mm wafer, and Square panel.

###For the configuration of the equipment, the cluster system allows to select configure the required number of processing units for required process capability.

Process Unit

###Coater

###Tazmo offers from the standard process for PR/PI coating ; Spin coat unit/ Bake unit/Cool unit, to the special process; Circulation spin cup unit/Spinless coating unit.

Especially, PI/PR thick film process 10~100um are our main target on PhotoLithography Process.

###Developer

###Basic paddle , spray developping process for PR/PI.

Dry Film process; temparature controling and high pressure is also available.

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

###From R & D to mass production configuration that takes into consideration will further improve the functionality.

Specification

Substrate sizes
φ200mm-300mm wafer
Control method
Desk top computer.
Power supply specifications
3φ AC200V 50/60Hz
SPR3000
SPR Series SPR3000

The SPR3000 series are a flagship model for mass production in BEOL, especiall thick film process.

TAZMO has spent over 40 years for Back end process, and developed High- performance process; Unti- Bake function, Tact Management function, etc.

For the configuration of the equipment, the cluster system allows to select configure the required number of processing units according to the required Coating and Developing processing and process capability.

Features

Platform

###SPR 3000 series are automatic coater/Developer for cassette to cassette , φ200mm~300mm wafer.

###For the configuration of the equipment, the cluster system allows to select configure the required number of processing units for required process capability.

Process Unit

###Coater

###Tazmo offers from the standard process for PR/PI coating ; Spin coat unit/ Bake unit/Cool unit, to the special process; Circulation spin cup unit/Spinless coating unit.

Especially, PI/PR thick film process 10~100um are our main target on PhotoLithography Process.

###Developer

###Basic paddle , spray developping process for PR/PI.

Dry Film process; temparature controling and high pressure is also available.

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Substrate sizes
φ200mm-300mm wafer
Spin cup for Coater/Developer
Max 4 cups
Bake & Cool
Max 16 units(250℃) - Anti-over bake function
Cool plate
Chiller(option)
High viscosity
Tazmo Designed Pump
High temperature Bake
Bake:(Max 450℃) (Option)
sem-eg@tazmo.co.jp

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