PRODUCTS

Clean Transfer System

Vacuum Robot

MTP Series For High VacuumFor High Vacuum Robot MTP-BB3-2

Engineered for low vibration and low noise, this robot supports the next generation of semiconductor fabrication equipment.

Features

###Compliant with 10^-6Pa vacuum environments by adapting servo motor on all axes and unique structure.

###Contact us for materials of end effector and wafer contact portion.

###Configurable with no vertical axis(Z) specifications(Contact us for details)

###Branching arm structure minimizes the turning radius of double hands with maximum reach.

Specification

Wafer handling
φ100mm to φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)6inch MASK
Range of motion
R:330㎜(maximum arm reach,excluding end-effector)T:370°(±185° from Home pos)Z:104㎜
Repeatability
XY:±0.1mm or less (3σ)Z:±0.05㎜
Handling system
Recess(Pocket)
Handling hold check
N/A
Vacuum isolation leve
10^-6Pa
Communication
RS-232C,RS-485(Serial Interface)Photo I/O(Parallel interface)
Utility
1φ AC200V~230V 5A 1line
Mass
Main body:Appox.76kgController(MCQ):Appox.16kg
高真空対応高真空ロボット
MTP Series For High VacuumFor High Vacuum Robot MTP-DB3-2

Engineered for low vibration and low noise, this robot supports the next generation of semiconductor fabrication equipment.

Features

###Compliant with 10^-6Pa vacuum environments by adapting servo motor on all axes and unique structure.

###Contact us for materials of end effector and wafer contact portion.

###Configurable with no vertical axis(Z) specifications(Contact us for details)

###Branching arm structure minimizes the turning radius of double hands with maximum reach.

Specification

Wafer handling
φ100mm to φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)6inch MASK
Range of motion
R:590°(maximum arm reach,excluding end-effector)T:370°(±185° from Home pos)Z:104°
Repeatability
XY:±0.1mm or less (3σ)Z:±0.05mm
Handling system
Recess(Pocket)
Handling hold check
N/A
Vacuum isolation leve
10^-6Pa
Communication
RS-232C,RS-485(Serial Interface)Photo I/O(Parallel interface)
Utility
1φ AC200V~230V 5A 1line
Mass
Main body:Appox.76kgController(MCQ):Appox.16kg
高真空対応高真空ロボット
MTP Series For High VacuumFor High Vacuum Robot MTP-DC5-2

Engineered for low vibration and low noise, this robot supports the next generation of semiconductor fabrication equipment.

Features

###Compliant with 10^-6Pa vacuum environments by adapting servo motor on all axes and unique structure.

###Contact us for materials of end effector and wafer contact portion.

###Configurable with no vertical axis(Z) specifications(Contact us for details)

###Free access arm stucture enables the rectangular coordinate access of vacuum chamber.

Specification

Wafer handling
φ100mm to φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)6inch MASK
Range of motion
R:590㎜(maximum arm reach,excluding end-effector)T:370°(±185° from Home pos)W1/W2:370°(±185° from Home pos)Z:160㎜
Repeatability
XY:±0.1mm or less (3σ)Z:±0.05㎜
Handling system
Recess(Pocket)
Handling hold check
N/A
Vacuum isolation leve
10^-6Pa
Communication
RS-232C(Serial Interface)
Utility
1φ AC200V~230V 25A 1line
Mass
Main body:Appox.120kgController(MCQ):Appox.20kg
sys-eg@tazmo.co.jp

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Sales Div.Transfer Business Unit

(086)239-5117

(086)239-5118

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