PRODUCTS

Semiconductor Manufacturing Equipment

Bonder/DebonderTWH Series

支持体機械剥離洗浄装置
TWH Series Mechanical Debonder Cleaner

The equipment that debond the carrier from a device wafer that is bonded with a thermosetting / UV curable adhesive/releasing layer.

After mechanical debonding, it automatically cleans the residue on the wafer.

Tape frame handling realizes the device wafer can be thinned to the limit of possible numerical values in theory.

Features

Platform

###Multi Layout system; Stand alone, semi-automatic and fully automatic equipments are available.

Process Unit

###Mechanical Debonding unit

###Wafer Cleaner 

###Various safety specifications; explosion-proof, fire difence law."

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Automatic Mechanical debonder cleaner
TWH-SR-CC series
Substrate sizes
φ200mm-300mm wafer on tape frame
Wafer Loader/Unloader
Tape frame cassette / Loadport
Carrier wafer Unloader
Open cassette
EFEM
Transfer Robot and Aligner
Mechanical Debonding Unit
1 unit only
Cleaning Unit
Max 2 units
PEEL装置
TWH Series PEEL Unit

Peeling off the residues remaining on the device wafer surface after debonding carrier. This peeling is performed by peeling tape.

It is recommended in the dry process and cost reduction.

Features

Platform

###Multi Layout system; Stand alone, semi-automatic and fully automatic equipments are available.

Process Unit

###Peel pressure monitoring function

###Tape Frame free function(Option)

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Peel Unit
TWH-PL series
Substrate sizes
φ200mm-300mm wafer
Peeling Pressure
0 ~ 300 N
Peeling Speed
0 ~ 20 mm/sec
Peel tape core diameter
φ76.8 mm
Other
comforms to safety standards
機械剥離装置
TWH Series Mechanical Debonder Cleaner

TAZMO has developed an overwhelming mechanical debonder over many years.

It has a strong power and soft structure for the device wafer and carrier.

(Patent Pending)

Features

Platform

###Available for thermosetting / UV curable adhesive

(room temparature) Mechanical debonding equipment

Process Unit

###TAZMO special desigh debonding Unit,(Patent Pending) Ultra Smoothness

###Processing wafer on Tape Frame.

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Mechanical Debonder
TWH-SR series
Substrate sizes
φ150mm-300mm wafer
Carrier Wafer
Si, glass, etc
Wafer handling
Tape frame handling
Wafer Chuck
Porous chuck
Debonding Method
TAZMO Designed Blade method
Other
Room temparature process
テープフレーム
対応洗浄装置
TWH Series Cleaner

Each wafer on tape frame can be cleaned with especial designed unit.

The tape frame has no solvent contact, but only devise wafer due to the special guard during cleaning process.

Features

Platform

###Multi Layout system; Stand alone, semi-automatic and fully automatic equipments are available.

Process Unit

###high-step device application

###Selectable nozzle system

###Available with 2 fluid sprays

###Available with an ultrasonic cleaning

###Waste liquid tank filtration method

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Cleaner
TWH-CC series
Substrate sizes
φ150mm-300mm wafer on tape frame
Rotation Speed
0 ~ 1500[rpm]
Nozzle Qty
Max 2 nozzles for each chamber
Other
comforms to safety standards
TWH Series Bonder

TAZMO new Bonder handling thermosetting type/thermoplastic type materials is available.

This new Bonder based on tool conept of cost-effectiveness as well as high-performance will satisfy customer's requirements.

Features

Platform

###Multi Layout system; Stand alone, semi-automatic and fully automatic equipments are available.

Process Unit

###Temperature up to 250℃

###Not only Glass bus also Si wafer can be used as support carrier

Operability

###Excellent operability with a GUI(Graphical User Interface)screen achieves easily edit complicated recipes.

Specification

Bonder
WH-BD series
Substrate sizes
φ200 or 300 mm
Alighment accuracy
X-Y: 30μm
Bonding pressure
φ300: 20kN φ200:10kN
Wafer Chuck
Electrostatic chuck
Temperature
Up to 250℃
Vacuum pressure
< 10Pa
Bonding accuracy
TTV < 3μm *uing bare wafer with 50μm film thickness
other
comforms to safety standards
sem-eg@tazmo.co.jp

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Sales Div. Process1 Business Unit

(086)239-5530

(086)239-5511

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