PRODUCTS

Clean Transfer System

Atmospheric Robot

サーボモーター仕様大気用クリーンロボット
Be compatible PLP Servo MotorClean Transfer Robot for the atomosphere Single

This product is the single robot developed for PLP.

Features

###Supported up to max. 650mm square substrate.

###Supported to long stroke elevating.

Specification

Target work
Square subtrate 300mm~650mm
Operating axis
R/T/Z/S
Range of motion
R:Maximum arm reach 760mm(from swivel center)T:±185degZ:500mmS:2000mm
Operating time
R:1.8sec/Full stroke(-520mm~760mm)T:2.0sec/180degZ:1.5sec/500mmS:2.5sec/2000mm
Repeatability
R:±0.2mmT:±0.03degZ:±0.1mmS:±0.25mm
Drive motor
AC Servo Motor
Speed control system
S-sharped acceleration/deceleration control
Communication
RS232C/ETHERNET
Utility
Power:Supplied from controllerVAC:-80kPa or less 15L/min or moreΦ6 one-touch joint 2 systems
Mass
Robot    Approx.110kgSlide Rail  Approx.220kg
サーボモーター仕様大気用クリーンロボット
Be compatible PLP Servo MotorClean Transfer Robot for the atomosphere Double

This product is the double robot developed for PLP.

Features

###Supported up to max. 650mm square substrate.

###Supported to long stroke elevating.

Specification

Target work
Square subtrate 300mm~650mm
Operating axis
R1/R2/T/Z/S
Range of motion
R:Maximum arm reach 760mm(from swivel center)T:±185degZ:500mmS:880mm
Operating speed
R1・R2:1.5sec/1175mmT:1.8sec/180degZ:2.0sec/500mmS:1.5sec/880mm
Repeatability
R1・R2:±0.1mm、T:±0.03degZ:±0.1mmS:±0.25mm
Drive motor
AC Servo Motor
Speed control system
S-sharped acceleration/deceleration change pulse generator control
Communication
RS232C/ETHERNET
Utility
Vacuum:-80kPa or less( Φ6×Φ4 tube one-touch joint connection ) 2systemsPower:Supplied from robot controller.
Mass
Robot    Approx.140kgSlide Rail  Approx.150kg
TT301A-RA Series
TT301A-RA Series Servo MotorClean Transfer Robot for the atomosphere TT301A-RA

This transfer robot was developed for EFEM to boost cost performance and realizes higher throughput.

This high-speed, ultra clean robot are the flagship model in the Tazmo line.

Features

###Promoting standardization of parts and modules enables low cost product.

###Our original high-speed exchange mechanism, enables wafer exchange using half of the original time.

###New control system realizes high-speed and smooth opreation.

###Compared to the conventional model, there is a reductation of 15% to the robot footprint and 50% of the controller volume.

###For SEMI F47.Guaranteed for 18 months by high reliability design.

###Mapping sensor options are available. Accesses two FOUPs without tracks.

Specification

Wafer handling
φ100mm to φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Range of motion
R:430㎜(maximum arm reach,excluding end-effector)T:370°(±185° from Home pos)Z:330㎜
Repeatability
XY:±0.1mm or less(3σ)Z:±0.05mm or less(3σ)
Wafer holding method
Selectable from options
Wafer detection
Vacuum sensor with digital display
Communication
RS232C,ETHERNET
Utility
Power:1φ AC200V~230V 5A 1lineVacuum:-80 kPa or less 15L/min or less 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
Mass
Main body:Appox.35kgController(TT301A):Appox.10kg
TT301A-WA Series
TT301A-WA Series Servo MotorClean Transfer Robot for the atomosphere TT301A-WA

This transfer robot was developed for EFEM to boost cost performance and realizes higher throughput.

This high-speed, ultra clean robot are the flagship model in the Tazmo line.

Features

###Promoting standardization of parts and modules enables low cost product.

###Compared to the conventional model, there is a reductation of 15% to the robot footprint and 50% of the controller volume.

###For SEMI F47.

###Guaranteed for 18 months by high reliability design.

###Mapping sensor options are available.

Specification

Wafer handling
φ100mm to φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Range of motion
R:346㎜(maximum arm reach,excluding end-effector)T:370°(±185° from Home pos)Z:330㎜
Repeatability
R:±0.1mm or less(3σ)T:±0.02deg or less(3σ)Z:±0.05mm or less(3σ)
Wafer holding method
Selectable from options
Wafer hold check
Vacuum sensor with digital display
Communication
RS232C,ETHERNET
Utility
Power:1φ AC200V~230V 5A 1lineVacuum:-80 kPa or less 15L/min or less 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
Mass
Main body:Appox.35kgController(TT301A):Appox.10kg
TT301A-WB Series
TT301A-WB Series Servo MotorClean Transfer Robot for the atomosphere TT301A-WB

This transfer robot was developed for EFEM to boost cost performance and realizes higher throughput.

This high-speed, ultra clean robot are the flagship model in the Tazmo line.

Features

###Promoting standardization of parts and modules enables low cost product.

###Compared to the conventional model, there is a reductation of 15% to the robot footprint and 50% of the controller volume.

###For SEMI F47.Guaranteed for 18 months by high reliability design.

###Mapping sensor options are available.

Specification

Wafer handling
φ100mm to φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Range of motion
R:250㎜(maximum arm reach,excluding end-effector)T:370°(±185° from Home pos)Z:330㎜
Repeatability
R:±0.1mm or less(3σ)T:±0.02deg or less(3σ)Z:±0.05mm or less(3σ)
Wafer holding method
Selectable from options
Wafer detection
Vacuum sensor with digital display
Communication
RS232C,ETHERNET
Utility
Power:1φ AC200V~230V 5A 1lineVacuum:-80 kPa or less 15L/min or less 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
Mass
Main body:Appox.34kgController(TT301A):Appox.10kg
TT301A-SA Series
TT301A-SA Series Servo MotorClean Transfer Robot for the atomosphere TT301A-SA

This transfer robot was developed for EFEM to boost cost performance and realizes higher throughput.

This high-speed, ultra clean robot are the flagship model in the Tazmo line.

Features

###Promoting standardization of parts and modules enables low cost product.

###Compared to the conventional model, there is a reductation of 15% to the robot footprint and 50% of the controller volume.

###For SEMI F47.Guaranteed for 18 months by high reliability design.

###Mapping sensor options are available.

Specification

Wafer handling
φ100mm to φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Range of motion
R:346㎜(maximum arm reach,excluding end-effector)T:370°(±185° from Home pos)Z:330㎜
Repeatability
R:±0.1mm or less(3σ)T:±0.02deg or less(3σ)Z:±0.05mm or less(3σ)
Wafer holding method
Selectable from options
Wafer detection
Vacuum sensor with digital display
Communication
RS232C,ETHERNET
Utility
Power:1φ AC200V~230V 5A 1lineVacuum:-80 kPa or less 15L/min or less 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
Mass
Main body:Appox.35kgController(TT301A):Appox.10kg
サーボモーター仕様フリーアクセスロボット
MTE Series Servo MotorFree Access Robot MTE-E

This transfer robot handles wafer sizes up to 300mm.

This high-speed, ultra clean robot is a flagship model in the Tazmo line.

Features

###Accesses three FOUPs without tracks.

###Changer mechanism reduces wafer swap-out times.

###Mapping sensor options are available.

###The modular design of the R・T unit and elevation unit enables easy maintenance, and also supports a long vertical stroke.

###A new line up for 450mm wafer transfer with improved arm rigidity.

Specification

Wafer handling
φ100mm to φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Range of motion
R:590㎜(maximum arm reach,excluding end-effector)T:350°(±175° from Home pos)W:350°(±180° from Home pos)Z:330㎜P:180deg
Repeatability
XY:±0.1mm or less(3σ)Z:±0.05mm or less(3σ)P:0.02deg or less(3σ)
Wafer holding method
Selectable from options
Wafer detection
Vacuum sensor with digital display
Communication
RS232C,RS-485
Utility
Power:1φ AC100V 7.5A 1line :1φ AC208V 5.0A 1lineVacuum:-80 kPa or less 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
Mass
Main body:Appox.50kgController(MCE):Appox.18kg
MTE Series Servo MotorFree Access Robot MTE-C

This transfer robot handles wafer sizes up to 300mm.

This high-speed, ultra clean robot is a flagship model in the Tazmo line.

Features

###Accesses two FOUPs without tracks.

###Mapping sensor options are available.

###The modular design of the R・T unit and elevation unit enables easy maintenance, and also supports a long vertical stroke.

###A new line up for 450mm wafer transfer with improved arm rigidity.

Specification

Wafer handling
φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Range of motion
R:430㎜(maximum arm reach,excluding end-effector)T:350°(±175° from Home pos)W:350°(±180° from Home pos)Z:330㎜P:180deg
Repeatability
XY:±0.1mm or less(3σ)Z:±0.05mm or less(3σ)P:0.05deg or less(3σ)
Wafer holding method
Selectable from options
Wafer detection
Vacuum sensor with digital display
Communication
RS232C,RS-485
Utility
Power:1φ AC200V~AC230V 5.0A 1lineDryair:0.5MPa 150L/min or more 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
Mass
Main body:Appox.60kgController(MCE):Appox.18kg
MTE Series Servo MotorFree Access Robot MTE-D

This transfer robot handles wafer sizes up to 300mm.

This high-speed, ultra clean robot is a flagship model in the Tazmo line.

Features

###Accesses two FOUPs without tracks.

###Mapping sensor options are available.

###The modular design of the R・T unit and elevation unit enables easy maintenance, and also supports a long vertical stroke.

###A new line up for 450mm wafer transfer with improved arm rigidity.

Specification

Wafer handling
φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Range of motion
R:480㎜(maximum arm reach,excluding end-effector)T:350°(±175° from Home pos)W:360°(±180° from Home pos)Z:330㎜P:185deg
Repeatability
XY:±0.1mm or less(3σ)Z:±0.05mm or less(3σ)P:±0.1deg or less(3σ)
Wafer holding method
Selectable from options
Wafer detection
Vacuum sensor with digital display
Communication
RS232C,RS-485
Utility
Power:1φ AC200V~AC230V 5.0A 1lineDryair:0.5MPa 150L/min or more 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
Mass
Main body:Appox.60kgController(MCE):Appox.18kg
サーボモーター仕様フリーアクセスロボット
MTE Series Servo MotorFree Access Robot MTE-G

This transfer robot handles wafer sizes up to 450mm.

Features

###Accesses two FOUPs without tracks.

###Mapping sensor options are available.

###The modular design of the R・T unit and elevation unit enables easy maintenance, and also supports a long vertical stroke.

###A new line up for 450mm wafer transfer with improved arm rigidity.

Specification

Wafer handling
φ300mm to φ450mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Range of motion
R:590㎜(maximum arm reach,excluding end-effector)T:350°(±175° from Home pos)W:350°(±180° from Home pos)Z:300㎜P:180deg
Repeatability
XY:±0.1mm or less(3σ)Z:±0.05mm or less(3σ)P:0.05deg or less(3σ)
Wafer holding method
Selectable from options
Wafer detection
Vacuum sensor with digital display
Communication
RS232C,RS-485
Utility
Power:1φ AC200V~AC230V 5.0A 1lineDryair:0.5MPa 150L/min or more 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
Mass
Main body:Appox.65kgController(MCE):Appox.18kg
ステッピングモーター仕様フリーアクセスロボット
MTSR Series Stepping MotorFree Access Robot MTSR-3

This transfer robot handles wafer sizes up to 300mm.

Features

###Mapping sensor options are available.Optimized software for maximum space saving.

###Space-saving using a built-in controller.

Specification

Wafer handling
φ100mm to φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Range of motion
R:374㎜(maximum arm reach,excluding end-effector)T:370°(±185° from Home pos)Z:380㎜
Repeatability
XY:±0.1mm or less(3σ)Z:±0.05mm or less(3σ)
Wafer holding method
Selectable from options
Wafer detection
Vacuum sensor with digital display
Communication
RS232C,RS-485
Utility
Driver power:DC24V±5% 10AControl power:DC24V±5% 3.15A Vacuum:-80 kPa or less 15L/min or less 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
Mass
Main body:Appox.35kgController(MCQ):Appox.10kg
ステッピングモーター仕様フリーアクセスロボット
MTSR Series Stepping MotorFree Access Robot MTSR-4

This transfer robot handles wafer sizes up to 300mm.

Features

###Mapping sensor options are available.Accesses two FOUPs without tracks.

###Optimized software for maximum space saving.

###Space-saving using a built-in controller.

Specification

Wafer handling
φ100mm to φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Range of motion
R:470㎜(maximum arm reach,excluding end-effector)T:370°(±185° from Home pos)W:370°(±185° from Home pos)Z:380㎜
Repeatability
XY:±0.1mm or less(3σ)Z:±0.05mm or less(3σ)
Wafer holding method
Selectable from options
Wafer detection
Vacuum sensor with digital display
Communication
RS232C,RS-485
Utility
Driver power:DC24V±5% 10AControl power:DC24V±5% 3.15A Vacuum:-80 kPa or less 15L/min or less 1line(φ6 × φ4 polyurethane tube one-touch fitting connected)
Mass
Main body:Appox.35kgController(MCQ):Appox.10kg

Sales Div.Transfer Business Unit

+81-86-239-5117

+81-86-239-5118

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