PRODUCTS

Clean Transfer System

MAF-M SeriesPre-Aligner

化合物・ガラス対応裏面吸着式
MAF-G Series For Compound Wafer,Glass WaferBackside VAC Chucking MAF-GA

This eage contact free unit aligns and centers both flat and notch type wafers at high speeds.

Features

###High speeds are enabled by the units ability to center wafers and perform angle alignment without a seperate chucking.

###Compatible with multiple wafers:200-300mm SEMI/JEIDA silicon wafers.

###Wafer size and nocth/flat are automatically recongnize,eliminating the need for host controller settings.

###Built-in controller for a compact design.

###Controllable through RS-232C or RS-485 serial interface or through photo I/O parallel communications.

###Configurable for compound semiconductor wafers and transparent glass wafers by utilizing CCD photo receiver for line sensor.

Specification

Wafer handling
φ200mm to φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Alignment time
4.5seconds or less(When Processing φ300mm)
Alignment accuracy
XY:±0.1mm or less(3σ)θ:±0.1° or less(3σ)
Wafer off-center limit
±5mm or less(Wafer offset from chuck center)
Wafer holding method
Backside vacuum chuck
Wafer detection
Vacuum sensor with digital display
Communication
RS-232C,RS-485(Serial Interface)Photo I/O(Parallel interface)
Utility
Power:DC24V±10% 5A 1lineVacuum:-80kPa or less.1line
Mass
Main body:Appox.12kg
MAF-G Series For Compound Wafer,Glass WaferBackside VAC Chucking MAF-GB

This eage contact free unit aligns and centers both flat and notch type wafers at high speeds.

Features

###High speeds are enabled by the units ability to center wafers and perform angle alignment without a seperate chucking.

###Compatible with multiple wafers:100-200mm SEMI/JEIDA silicon wafers.

###Wafer size and nocth/flat are automatically recongnize,eliminating the need for host controller settings.

###Built-in controller for a compact design.

###Controllable through RS-232C or RS-485 serial interface or through photo I/O parallel communications.

###Configurable for compound semiconductor wafers and transparent glass wafers by utilizing CCD photo receiver for line sensor.

Specification

Wafer handling
φ100mm to φ200mm SEMI/JEIDA standard wafer. (Please inquire with regard to special wafers such as glass wafers.)
Alignment time
5.5seconds or less (When Processing φ200mm)
Alignment accuracy
XY:±0.1mm or less(3σ) θ:±0.1° or less(3σ)
Wafer off-center limit
±5mm or less (Wafer offset from chuck center)
Wafer holding method
Backside vacuum chuck
Wafer detection
Vacuum sensor with digital display
Communication
RS-232C,RS-485(Serial Interface) Photo I/O(Parallel interface)
Utility
Power:DC24V±10% 5A 1line Vacuum:-80kPa or less.1line
Mass
Main body:Appox.12kg
MAF-G Series For Compound Wafer,Glass WaferBackside VAC Chucking MAF-GC

This eage contact free unit aligns and centers both flat and notch type wafers at high speeds.

Features

###High speeds are enabled by the units ability to center wafers and perform angle alignment without a seperate chucking.

###Compatible with multiple wafers:150-300mm SEMI/JEIDA silicon wafers.

###Wafer size and nocth/flat are automatically recongnize,eliminating the need for host controller settings.

###Built-in controller for a compact design.

###Controllable through RS-232C or RS-485 serial interface or through photo I/O parallel communications.

###Configurable for compound semiconductor wafers and transparent glass wafers by utilizing CCD photo receiver for line sensor.

Specification

Wafer handling
φ150mm to φ300mm SEMI/JEIDA standard wafer. (Please inquire with regard to special wafers such as glass wafers.)
Alignment time
4.5seconds or less (When Processing φ300mm)
Alignment accuracy
XY:±0.1mm or less(3σ) θ:±0.1° or less(3σ)
Wafer off-center limit
±5mm or less (Wafer offset from chuck center)
Wafer holding method
Backside vacuum chuck
Wafer detection
Vacuum sensor with digital display
Communication
RS-232C,RS-485(Serial Interface) Photo I/O(Parallel interface)
Utility
Power:DC24V±10% 5A 1line Vacuum:-80kPa or less.1line
Mass
Main body:Appox.12kg
MAF-G Series For Compound Wafer,Glass WaferBackside VAC Chucking MAF-GM_Z

This eage contact free unit aligns and centers both flat and notch type wafers at high speeds.

Features

###High speeds are enabled by the units ability to center wafers and perform angle alignment without a seperate chucking.

###Compatible with multiple wafers:50.8-100mm SEMI/JEIDA silicon wafers.

###Wafer size and nocth/flat are automatically recongnize,eliminating the need for host controller settings.

###Built-in controller for a compact design.

###Controllable through RS-232C or RS-485 serial interface or through photo I/O parallel communications.

###Configurable for compound semiconductor wafers and transparent glass wafers by utilizing CCD photo receiver for line sensor.

Specification

Wafer handling
φ50.8mm to φ100mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Alignment time
9.0seconds or less(When Processing φ100mm)
Alignment accuracy
XY:±0.2mm or less(3σ)θ:±0.2° or less(3σ)
Wafer off-center limit
±4mm or less(Wafer offset from chuck center)
Wafer holding method
Backside vacuum chuck
Wafer detection
Vacuum sensor with digital display
Communication
RS-232C,RS-485(Serial Interface)Photo I/O(Parallel interface)
Utility
Power:DC24V±10% 5A 1lineVacuum:-80kPa or less.1lineDry air:0.4MPa±50kPa 1line
Mass
Main body:Appox.12kg
化合物・ガラス対応裏面吸着式
MAF-G Series For Compound Wafer,Glass WaferBackside VAC Chucking MAF-GP-Z

This eage contact free unit aligns and centers both flat and notch type wafers at high speeds.

Features

###High speeds are enabled by the units ability to center wafers and perform angle alignment without a seperate chucking.

###Compatible with multiple wafers:50.8-100mm SEMI/JEIDA silicon wafers.

###Wafer size and nocth/flat are automatically recongnize,eliminating the need for host controller settings.

###Built-in controller for a compact design.

###Configurable for compound semiconductor wafers and transparent glass wafers by utilizing CCD photo receiver for line sensor.

Specification

Wafer handling
φ50.8mm to φ100mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Alignment time
4.5seconds or less(When Processing φ100mm)
Alignment accuracy
XY:±0.2mm or less(3σ)θ:±0.2° or less(3σ)
Wafer off-center limit
±4mm or less(Wafer offset from chuck center)
Wafer holding method
Backside vacuum chuck
Wafer detection
Vacuum sensor with digital display
Communication
RS-232C,RS-485(Serial Interface)Photo I/O(Parallel interface)
Utility
Power:DC24V±10% 5A 1lineVacuum:-80kPa or less.1lineDry air:0.4MPa±50kPa 1line
Mass
Main body:Appox.14kg
化合物・ガラス対応エッジホールド式
MAF-M Series For Compound Wafer,Glass WaferEdge Hold MAF-MH

This 300mm mechanically clamping wafer aligner minimizes wafer particle contamination by avoiding contact with the backside of the wafer.

Features

###Configurable for compound semiconductor wafers and glass wafers.(Please inquire for details)

###Clean alignment enabled by limiting contact to the wafer edge.

###Notch/Flat are automatically recognized, eliminating the need for host controller settings.

###Built-in controller for a compact design.

Specification

Wafer handling
φ300mm SEMI/JEIDA standard wafer.(Please inquire with regard to special wafers such as glass wafers.)
Alignment time
8.0seconds or less(20.0seconds of less when separate chucking required)
Alignment accuracy
θ:±0.2° or less(3σ)
Wafer off-center limit
±1mm or less(Wafer offset from chuck center)
Wafer holding method
Edge hold
Wafer detection
Photo micro sensor
Communication
RS-232C(Serial Interface)
Utility
Power:DC24V±10% 3A 1lineDry air:φ6mm 0.35MPa to 0.4MPa 1line
Mass
Main body:Appox.8kg
化合物・ガラス対応エッジホールド式
MAF-M Series For Compound Wafer,Glass WaferEdge Hold MAF-MJ

This 300mm mechanically clamping wafer aligner minimizes wafer particle contamination by avoiding contact with the backside of the wafer.

Features

###Configurable for compound semiconductor wafers and glass wafers.(Please inquire us for details)

###Clean alignment enabled by limiting contact to the wafer edge.

###Notch/Flat are automatically recognized, eliminating the need for host controller settings.

###Built-in controller for a compact design.

Specification

Wafer handling
φ200mm SEMI/JEIDA standard wafer.
Alignment time
8.0seconds or less(20.0seconds of less when separate chucking required)
Alignment accuracy
θ:±0.2° or less(3σ)
Wafer off-center limit
±2mm or less(Wafer offset from chuck center)
Wafer holding method
Edge hold
Wafer detection
Photo micro sensor
Communication
RS-232C(Serial Interface)
Utility
Power:DC24V±10% 5A 1lineDry air:φ6mm 0.12MPa to 0.2MPa 1line
Mass
Main body:Appox.8kg
lcd-eg@tazmo.co.jp

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Sales Div.Transfer Business Unit

(086)239-5117

(086)239-5118

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